Structure for filtering CVD chamber process gases

ABSTRACT

A structure for filtering process gases prior to said process gases being allowed to enter a CVD chamber includes improved filter and control means to ensure high purity of the process gases. In one embodiment, a first filter means is located in a first section of a gas line being isolated by valves at both ends of the gas line section. A second filter means is located in a downstream gas line section for further filtering.

This application is a division of application Ser. No. 07/461,959, filedJan. 8, 1990.

FIELD OF THE INVENTION

This invention relates to integrated circuits implemented in silicon,and in particular to an improved process for providing electricalcontact to silicon using a refractory metal.

BACKGROUND OF THE INVENTION

In providing electrical connections to silicon for microelectronicsapplications, it is frequently desired to provide a conductive interfacebetween a metallization layer, such as aluminum (Al), and the portion ofsilicon to be electrically connected to the aluminum to prevent directcontact of the aluminum with the silicon. If aluminum were to bedirectly deposited onto the silicon, various problems may arise.

One significant problem in depositing aluminum directly on silicon isthat the aluminum acts as a P-type dopant, and any migration of aluminumatoms into a silicon region would dope the silicon region with P-typeimpurities. This is especially significant when the aluminum contacts anN-type silicon region, where the migration of P-type aluminum atoms intothe silicon region results in an undesired rectifying contact.

Another problem is that the aluminum is prone to spiking through shallowsilicon regions, thus causing the aluminum to contact the underlying oradjacent silicon region.

A further problem relates to the shadowing effect, where an oxide layeris etched to expose a silicon region, and the relatively high stepbetween the top surface of the oxide and the exposed silicon results inuneven deposition of aluminum on the exposed silicon surface and on theoxide walls. This may even result in an open circuit due to insufficientaluminum being deposited on the exposed silicon or oxide walls.

With decreasing geometries, the above problems become more acute.Further, increased reaction temperatures exacerbate the above-mentionedproblems, since the migration of aluminum atoms into the silicon isaccelerated with increasing temperatures. Additionally, over a period oftime, the aluminum atoms further migrate into the silicon causing latentdefects and low reliability contacts.

Various schemes are used in the prior art to avoid the above-mentionedproblems incurred by direct contact of aluminum with silicon,. One wayto overcome the above-mentioned problems is to saturate the aluminumduring deposition with silicon (typically 0.2-1 weight % of Si to Al) toinhibit migration of the aluminum atoms. One drawback with this methodis that the saturation level of aluminum is higher at highertemperatures so that when the saturated aluminum cools, a precipitate ofsilicon exists at the surface of the silicon substrate under thealuminum layer, resulting in an undesired P-type epitaxial layer.Additionally, the problem of shadowing effect still exists using theabove method.

Another prior art method used to avoid the problems resulting fromdirect contact of aluminum with silicon is to form on or more interfacelayers over the silicon before depositing the aluminum metallizationlayer. This type of process is generally described din U.S. Pat. No.3,777,364 to Schinella et al., although numerous other patents describesimilar processes. In this prior art method, a refractory metal, such astungsten, molybdenum, palladium, platinum, or tantalum, is deposited andreacted with the exposed silicon (or a polysilicon layer) to form asilicide layer. The tope portion of the deposited refractory metal,which has not reacted with the silicon, may then be removed. Thealuminum metallization layer is then deposited. The resulting silicidelayer between the aluminum and silicon acts as a barrier to the aluminumatoms, preventing migration of the aluminum into the silicon, andprovides a low resistivity contact between the aluminum and the silicon.Additionally, this type of process slightly reduces the step height(e.g., by 1200 Å) during deposition of the aluminum metal layer.

A problem with the above teaching of forming a silicide layer is that,when forming, for example tungsten silicide as the interface layerbetween aluminum and silicon using a chemical vapor deposition (CVD)process and tungsten hexafluoride (WF₆) as the reactant gas, the hightemperatures involved in the CVD process cause the hot CVD chamber wallsto react with the WF₆ gas. This results in a lowering of the depositionrate of the tungsten onto the surface of the wafer.

Although sputtering tungsten onto the surface of the wafer does notincur the problem of hot walls of a chamber reacting with the metallicfluoride gas, sputtering refractory metal films is subject to thefollowing limitations: (1) such films are frequently highly stressed andcrack; (2) such films are characterized by relatively poor stepcoverage; (3) such films are relatively costly to produce; (4) only arelatively small number of wafers can be processed in a given amount oftime; and (5) sputtering equipment is relatively expensive to purchaseand operate.

Thus, using a hot-wall CVD process to deposit a refractory metal ontothe silicon results in the deposition rate being limited, and theproblem with step height is not avoided to the extend desirable.

U.S. Pat. No. 4,794,019 to Miller describes a tungsten depositionprocess using a hot-wall CVD chamber and mentions that the depositionrate of the tungsten decreases with time to reach a stable value of 25Å/min at a thickness of about 3000 Å (col. 3, lines 31-33). Millerteaches a CVD process temperature on the order of 300° C. to deposit thetungsten on the surface of the silicon wafer. Since tungsten nucleateswell to silicon but not to SiO₂ at this temperature, this process isused to selectively deposit the tungsten on the silicon and not on SiO₂.By using this method, however, an increase in the thickness of therefractory metal over approximately 3000 Å is relatively time consumingand expensive.

One way used to solve the problem of low deposition rates due to the hotwalls of the a chamber reacting with the metallic fluoride gas is toheat the wafers locally using direct irradiation of the wafer by meansof a quartz halogen lamp or some other source of radiation. This methodof heating the wafer, however, results in different refractory metaldeposition rates on N and P type silicon regions due to the differentemissivities of these two regions when heated by a radiation source.This uneven deposition increases the difficulty of efficientlydepositing a metal interconnect layer providing good electrical contactto both the N and P type silicon regions.

What would be desirable in the industry is a method of depositing arefractory metal as a barrier layer between aluminum and silicon at arelatively high deposition rate so as to reduce step height to adesirable amount, and which would result in an even deposition ofrefractory metal over both exposed N an P type silicon regions.

SUMMARY OF THE INVENTION

The present inventive process relates to the deposition of a refractorymetal onto a silicon surface for use in the manufacture ofmicroelectronic circuits. In one embodiment the deposition is acontrollable selective deposition.

To avoid the various problems discussed previously, a cold wallradiantly heated chemical vapor deposition (CVD) system is preferablyused to deposit the refractory metal, wherein each wafer is heated by,for example, a broad band light source. Thus, the deposition of therefractory metal onto the wafer to form a barrier layer between thesilicon substrate and an aluminum layer will not be limited by anyreaction of the process gases (e.g., WF₆) with high temperature chamberwalls.

In a preferred embodiment, to avoid the varying deposition rates on Nand P type silicon regions due to the different emissivities of thesetwo regions when subjected to radiation, an optically opaque layer(e.g., at least 100-500 Å), of the refractory metal is first formed onboth the N and P type silicon regions prior to the N and P type regionsreaching a temperature of approximately 100° C. The opaque layer isdesirable to form at below 100° C. since at above 100° C. theemissivities of the N and P type regions begin to widely diverge. Oncethe opaque refractory metal layer has been established, the emissivitiesof both and N and P type regions at the higher processing temperatureswill be approximately that of the refractory metal, thereby establishingan approximately equivalent deposition rate on both N and p type siliconregions.

Additionally, at the higher deposition temperatures (e.g., 200°-300°C.), in the preferred embodiment, the amount of reducing gas (e.g.,SiH₄) introduced into the CVD chamber to reduce the refractory metal gas(e.g., WF₆) is ramped up with time so that, as the thickness of thedeposited refractory metal increases and the temperature of the contactarea increase due to the exothermic reduction reactions, more reducinggas is made available in the CVD chamber to increase the deposition rateof the refractory metal.

The various steps used in the preferred process for forming a silicidebarrier layer comprise: (1) cleaning the exposed surface of a siliconwafer to remove organic and metallic contamination from the siliconregions to be contacted; (2) cleaning the surface of the wafer to removeoxide from the silicon regions to be contacted; (3) removing any damageto the silicon crystal lattice structure so that the refractory metalwill nucleate rapidly and in a predictable manner; (4) urging thevarious gas lines and process chamber to ensure high purity of theprocess gases and accurate flow rates; (5) saturating the siliconsurface at approximately room temperature (3 e.g., 20°-30° C.) with arefractory metal gas to form an initial layer of refractory metal on thesilicon surface to act as a catalyst for subsequent deposition of therefractory metal and to form a strong bond between the silicon surfaceand the subsequently formed barrier layer; (6) ramping the temperatureof the wafer, while injecting process gases into the CVD chamber, at aslow enough rate to form an optically opaque layer (e.g., at least100-500 Å) of refractory metal on the exposed silicon regions prior tothe temperature of the regions reaching approximately 100° C.; (7)heating the wafer at a relatively constant deposition temperature whileramping up the supply of reducing gas to increase the deposition rate ofrefractory metal as the exothermic reduction reactions continue toincrease the temperature of the deposited refractory metal layer; (8)annealing the wafer at a temperature above approximately 650° C. tosilicide the refractory metal/silicon surface interface and to react thesilicon atoms within the deposited refractory metal to form a silicidein order to lower contact resistivity; and (9) cooling the wafer beforeremoval from the CVD chamber.

In the preferred embodiment of the novel process summarized above, asilicon-based reducing gas (e.g., SiH₄) is used in step 7 to reduce therefractory metal gas (e.g., WF₆) so that silicon atoms are depositedalong with the refractory metal. Thus, when the refractory metal andsilicon undergo the thermal anneal step 8, the silicon substrate is tosignificantly consumed.

In addition to the previously described features providing theadvantages of high deposition rate and equal deposition on N and P typeregions, further novel features of the above described process includeusing a high conductance vacuum system to limit the residence time ofany impurities in the chamber, using a novel diffusing means inside theCVD chamber for diffusing process gases as they enter the CVD chamber,and using an improved gas distribution and filtering system.

An additional novel process step includes cleaning the CVD chamber,after completing a number of refractory metal deposition processes, byheating the CVD chamber to above approximately 65° C. during in-situ NF₃cleaning of the CVD chamber to avoid condensation of by-products on thewalls of the chamber.

Minor modifications of the deposition process summarized above enablethe process to be used for blanket deposition of a refractory metal andfor deposition of a refractory metal for use as a via between twoconductive layers. A novel apparatus is also describe for forming vias,which enables the transfer of wafers from a sputter etch station to aCVD chamber under low pressure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1a-1e are cross-sectional diagrams of a silicon wafer undergoing arefractory metal deposition process in accordance with a preferredembodiment of the invention.

FIG. 2a shows the components within a gas distribution box used in thepreferred embodiment of the invention.

FIG. 2b shows the gas distribution box of FIG. 2a along with heatingelements used for baking components within the distribution box.

FIG. 3 shows a CVD chamber used in the preferred embodiment f theinvention.

FIG. 4 is a graph showing emissivity vs. temperature of N and P typesilicon regions.

FIG. 5 is a graph showing the Si/W ration of a deposited layer vs. theSiH₄ WF₆ process gas ratio.

FIG. 6 is a graph showing deposition rate vs. SiH₄ /WF₆ ratio.

FIGS. 7a-7d are cross-sectional diagrams of a silicon wafer undergoing ablanket deposition process in accordance with a preferred embodiment ofthe invention.

FIG. 8 is a cross-sectional diagram of a silicon wafer after completionof ha process for forming a via between a polysilicon layer and a metallayer in accordance with a preferred embodiment of the invention.

FIGS. 9a-9d are cross-sectional diagrams of a silicon wafer aftercompletion of a process for forming a via between two metal layers inaccordance with a preferred embodiment of the invention.

FIG. 10 shows a preferred embodiment structure for carrying out a viaformation process.

FIG. 11 shows the gas distribution network for sputter etch gases.

FIGS. 12 and 13 show perspective views of a gas diffusing measured inthe preferred embodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION A. SELECTIVE DEPOSITION PROCESS

To selectively deposit a refractory metal on an exposed silicon surfacefor improved electrical contact between a metallization layer and thesilicon, while achieving the advantages previously described, thebelow-described preferred process is used.

Initially, a silicon wafer is processed using well known andconventional methods to form various regions in the silicon substratefor electrical contact thereto by an aluminum interconnection layer. Alayer of silicon dioxide or other insulating layer is then formed overthe surface of the wafer and etched using well known techniques toselectively expose regions of the silicon substrate for electricalcontact of these exposed regions with the metal layer. An illustrativeprocess for forming exposed silicon regions is described in U.S. Pat.No. 4,546,370, incorporated herein by reference.

A(1). REMOVE CONTAMINATION FROM EXPOSED SILICON SURFACE

In step 1 of the preferred process to selectively form a barrier layerover the exposed silicon regions, the wafer is subjected to a 120° C.sulfuric peroxide acid bath for approximately five minutes to removeorganic and metallic contamination from the exposed substrate surface.Any of the well known and conventional techniques for removingcontaminants may also be used for this step. This step may be omitted ifthe contamination of the exposed substrate surface is deemed to beinsignificant.

A(2). REMOVE OXIDE FROM EXPOSED SILICON SURFACE

In step 2, the wafer is subjected to a buffered oxide etchant, such asthat comprising five parts ammonium fluoride, one part hydrofluoricacid, and eight parts water, for approximately six second s at roomtemperature. This step removes native and other oxides from the exposedsubstrate surface. This step may be omitted if the exposed surface isdeemed to be sufficiently free of oxide. Any number of otherconventional and well known techniques for removal step also removes aportion of the surface of the patterned oxide; however, since thispatterned oxide is relatively thick, this reduction in its thickness isnegligible.

A(3). REMOVE ANY DAMAGE TO CRYSTALLINE STRUCTURE

In step 3, any damage to the exposed silicon surface caused by any ionimplantation or etching process is removed by a conventional nitrogentrifluoride (NF₃) silicon etch or any other conventional and well knownetching technique which would accomplish this step. This particularprocess using an NF₃ etchant actually removes a top layer of the siliconwhere the damage to the crystal structure occurs. The silicon crystallattice damage is preferably removed so that the refractory metal willnucleate rapidly with the silicon surface and in a predictable manner.This step may be omitted if the damage to the crystal lattice structureis not significant.

Instead of an etch of the silicon to remove any damage, a rapid thermalanneal may be performed to realign the silicon atoms and reform thecrystal lattice structure. This anneal step is preferably conducted atbetween approximately 600° C.-850° C. for ten to sixty seconds dependingon the type and amount of damage to be repaired.

A representative wafer having undergone steps 1-3 is shown in FIG. 1a.Silicon wafer 1 is shown having exposed N type region 2 and P typeregion 3, and having patterned oxide layer 4. Wafer 1 is then placed ina CVD chamber such as that shown in FIG. 3 and described in U.S. Pat.No. 4,796,562, incorporated herein by reference. The CVD chamber of FIG.3 will be described later.

A(4). PURGE GAS LIENS FOR HIGH PURITY

In step 4, to ensure gas purity and stability, the process gases arepurged through a bypass-to-waste vacuum line for at least seven secondsbefore the gas is allowed to be routed into the CVD process chambercontaining wafer 1. To achieve the highest gas purity, this step 4 isconducted after each completed deposition process; however, this stepmay be omitted depending on the purity level tolerable and the desiredaccuracy of the flow rates.

FIG. 2a is a schematic diagram of the gas routing, filtering, andpurification network 5 used in the preferred embodiment CVD system. Inthe preferred embodiment, high purity (e.g., at least 99.999% pure)process gases SiH₄, H₂, Ar, and WF₆ are supplied to input ports 6, 7, 8,and 9, respectively, of network 5 as shown. CVD chamber etchant gas SF₆and NF₃ are supplied to input ports 10 and 11, respectively. To maintainhigh purity, all gas lines used are electropolished stainless steel.

Initially, during standby mode between processing of wafer lots when thedeposition system will not be used for four hours or more, process gasvalves 12-15, 22, 24, 26, 27, 40, 41, 47, and 48 are closed to isolateprocess gas lines 25, 30, 46, and 51. Etchant gas valves 16, 17, 34 and38 are closed, as well as N₂ valve 32, since these lines do not need tobe purged of impurities. Also, nitrogen backfill valves 55 and 56 areclosed, as the backfill is used solely for dilution of the toxic and/orpyrophoric gases, and for diagnostic purposes, during maintenance. Allother valves are open to pressurize the process gas lines with N₂ toprevent contaminants from entering the lines. Specifically, valves 18-21and 23 are opened to allow N₂ to pressurize SiH₄ gas line 25. Valves 28and 29 are opened to allow N₂ to pressurize H₂ gas line 30.

Valves 31 and 42-45 are opened to allow N₂ to pressurize Ar gas line 46.Valves 49 and 50 are opened to allow N₂ to pressurize WF₆ gas line 51.

Gas lines 52, 53, and 54 connect to gas lines leading into a CVD chamberand are isolated for network 5 by the closure of the appropriate valvesas discussed above.

A vacuum system connected to vacuum lines 57 and 58 pull N₂ through thevarious process gas lines at a rate of approximately 1 liter/minuteduring this standby mode. The various mass flow controllers (MPCs) 76,77, 80, and 81 are of the high bypass type, such as the STEC model3400SL-SP-UC bakeable MFC, available from STEC Corporation of Japan. Thevalves within dashed lines are of a monoblock design and are valveswithin dashed lines are of a monoblock design and are high precisionvalves, such as Motoyama model MVILM00BB, available for MotoyamaCorporation of Japan.

To accomplish step 4 to purge SiH₄ gas line 25 and H₂ gas line 30 aftera wafer has been placed in the CVD chamber, valves 19, 20, and 28 areclosed to cut off the supply of N₂ to gas lines 25 and 30.

Next, valves 12, 13, 22 and 26 are opened to allow the SiH₄ and H₂ gasesto flow through lines 25 and 30 and through vacuum line 57. The flowrate of the SiH₄ and H₂ is determined by the pressure created by a pump(not shown) connected to vacuum line 57 and the extent of opening ofMFC's 76 and 77. Preferably, the flow rate of all the gases during thispurging step is equal to the flow rates to be used during the refractorymetal deposition process so that there will be no surging of the processgases when the gases are allowed to enter gas line 52.

To purge Ar gas line 46 and WF₆ gas line 51, valves 42, 44, and 49 areclosed to cut off the supply of N₂ to gas lines 46 and 51.

Next, valves 14, 15, 40 and 47 are opened to allow the Ar and WF₆ gasesto flow through lines 46 and 51 and through vacuum line 58. The flowrates of the Ar and WF₆ are determined by the pressure created by a pump(not shown) connected to vacuum line 58 and the extent of opening ofMFC's 80 and 81 and are set to be equal to the flow rates to be usedduring the refractory metal deposition process.

This purging of the gas lines is to be maintained for at least sevenseconds to ensure high purity and flow rate stability.

Process gases may now be controlled to enter the CVD process chamber viagas lines 52 or 54 by controlling valves 23, 24, 27, 29, 41, 43, 48, and50 connected between vacuum lines 57 and 58, process gas lines 25, 30,46, and 51, and CVD gas lines 52 and 54.

The SiH₄ reducing gas entering input port 6, the H₂ gas entering inputport 7, and the Ar gas entering input port 8 are filtered by appropriateNanochem™ filters 60, 61, and 62, respectively, which contain anorganometallic compound, and again filtered by conventional porous typegas filters 70, 71, and 72, respectively. Nanochem™[filters aremanufactured by Semi-Gas, Inc., San Jose. Calif. The Ar gas isadditionally filtered by Saes-Purifier™ filter 73, model St707,containing fettering material Zr-V-Fe. Etchant gases SF₆ and NF₃ arefiltered by conventional porous type filters 74 and 75, respectively.The flow of the gases in lines 25, 30, 35, 39, 46, and 51 is controlledand measured by mass flow controllers (MFC) 76-71, respectively.

Dew point sensors (not shown) are placed in vacuum lines 57 and 58, andin N₂ lines 84 and 85, to detect whether the H₂ O vapor content in theselines is below a predetermined level.

Prior to being used as part of a CVD system, gas routing and filteringnetwork 5 is baked at approximately 125° C. for approximately 37 hoursto bake out the water vapor in the gas lines. As represented in FIG. 2b,resistive heating elements 87 are contained within the network 5enclosure for this purpose. The components 88 comprising network 5 aremounted on an aluminum substrate 89, and resistive heating elements 87are mounted on the other side of the substrate 89 for heating thesubstrate and baking components 88. Residual gas analyzers are used todetect impurities in the gas lines.

Between wafers, when the deposition system is in a short term standbymode, all gases in process gas lines 25, 30, 46, and 51 are withdrawnvia vacuum lines 57 and 58 to prevent thermal siphoning and/orcorrosion. This is accomplished by closing valves 22, 24, 26, 27, 40,41, 47, and 48 and opening valves 23, 29, 43, and 50 to coupled gaslines 25, 30, 46, and 51 to vacuum lines 47 and 58.

Other well known process gases for performing the function, described indetail below of gases SiH₄, H₂, Ar, and WF₆ may be substituted for thegases used in the preferred process described herein.

A(5) SATURATE EXPOSED SILICON SURFACES WITH REFRACTORY METAL BASED GAS

In step 5, as shown in FIG. 1b, a refractory metal based gas is allowedto enter the CVD process chamber containing wafer 1 to saturate theexposed silicon regions 2 and 3 at room temperature (e.g., less than 30°C.) before any reducing gas is pumped into the chamber. In a preferredembodiment, WF₆ is used to saturate the silicon substrate surface.However, any well known refractory metal based gas which can be reducedby silicon to deposit a refractory metal layer may also be used. Thissaturation step results in the WF₆ being reduced by the exposed siliconso as to form a few monolayers of tungsten 90 on the exposed siliconregions 2 and 3. The WF₆ is reduced by the exposed silicon in accordancewith the following reaction:

    2WF.sub.6 +3SI→2W+3SiF.sub.4                        (eq. 1)

As seen from eq. 1,the fluorine atoms from the WF₆ are removed as avolatile reaction product (SiF₄), and tungsten is deposited on thesurface of the silicon. At room temperature, the reaction of the Sisurface with the WF₆ may not be sufficient to form a refractory metallayer which covers the entire surface of the exposed silicon. This baselayer of tungsten bonds strongly with the exposed silicon and, thus,increases the bonding strength of the subsequently formed barrier layerwith the silicon substrate. This base layer also acts as a catalyst forthe deposition of additional tungsten to promote the selectivedeposition of the refractory metal on essentially only the silicon andnot on the SiO₂ insulating layer 4. A layer of tungsten is not formed onSiO₂ layer 4, since the SiO₂ will not significantly reduce the WF₆ atroom temperatures.

In the preferred embodiment, step 5 is conducted by controlling processgas valves 27, 41 and 48 of FIG. 2 to control the flow of H₂, Ar, andWF₆ entering the CVD chamber.

Table I below shows process parameters for the various steps used in thepreferred embodiment process for selectively depositing a refractorymetal layer. Step 5 corresponds to parameter setting A in Table I.

                                      TABLE I                                     __________________________________________________________________________    Parameter                                                                           Dur.                                                                             Temp.  Pressure                                                                             BSGAS                                                                              SiH.sub.4                                                                         WF.sub.6                                                                          H.sub.2                                                                           Ar                                    Setting                                                                             (sec)                                                                            (°C.)                                                                         (mtorr)                                                                              (torr)                                                                             (sccm)                                                                            (sccm)                                                                            (sccm)                                                                            (sccm)                                __________________________________________________________________________    A      7 Ambient (A)                                                                          80     0.5  0   4.0 150 5                                              (≦30° C.)                                              B      5 A (≦30° C.)                                                            80     0.5  2.6 4.0 150 5                                     C     45 260    80     0.5  2.6 4.0 150 5                                              (A→260)                                                       D     10 260    80     0.5  2.6 4.0 150 5                                     E     10 260    80     0.5  2.8 4.0 150 5                                     F     10 260    80     0.5  3.0 4.0 150 5                                     G     10 260    80     0.5  3.2 4.0 150 5                                     H     10 260    80     0.5  3.4 4.0 150 5                                     I      5 A      BASE   0    0   0    0  0                                              (260→A)                                                                       (≦18 mtorr)                                            J     45 A      800    1.0  0   0   300 50                                    K      5 A      BASE   0    0   0    0  0                                     L     20 700    80     0.5  0   0   150 5                                              (A→700)                                                       __________________________________________________________________________

As seen from Table I, this step is conducted for approximately 7 secondsat a WF₆ flow rate of 4.0 sccm (standard cubic centimeters per minute)and a CVD chamber pressure of 80 mtorr.

To maintain the proper flow rate and pressure in the CVD chamber, H₂ isalso injected into the chamber at a rate of 150 sccm by opening valve27. H₂ does not act as a reducing gas at this low temperature and, thus,acts as an inert gas. A small amount of Ar gas is also injected into thechamber at a rate of 5 sccm by opening valve 41. The Ar gas is used as acarrier gas to facilitate the flow of WF₆ in gas line 54.

FIG. 3 is a cross-sectional diagram of the chamber portion of a modifiedVarian Model 5101 CVD system used in the preferred embodiment process.The Varian Model 5101 CVD system is described in U.S. Pat. No.4,796,562, incorporated herein by reference.

In FIG. 3, wafer 1 is shown held in place by wafer clamp assembly 100,securing wafer 1 to quartz chuck 102, and having a front surface facingreaction chamber 104. The refractory metal based gas (e.g., WF₆) isinjected into chamber 104 through outer gas injector ring 108, wherering 108 allows the gas to exit through a diffusing means forming aportion of the wall of ring 108. A novel diffusing means is used in thepreferred embodiment process and will be described in detail later withreference to FIGS. 11-12. The gas enters ring 108 through an inlet port(not shown), which is connected to gas line 54 in FIG. 2. As seen inFIG. 2, ar gas also flows through gas line 54.

Inner gas injector ring 110 is similar to ring 108 and is connected togas line 52 in FIG. 2 for the injection of the reducing gas (e.g., SiH₄)and H₂ into chamber 104. Gas deflector 105 acts to help mix the gasesinjected into gas mixing chamber 106 prior to the gases entering intoreaction chamber 104.

Further features of the CVD chamber of FIG. 3 will be explained whenpertinent to a particular process step. Further details of the CVDchamber of FIG. 3 can be obtained from U.S. Pat. No. 4,796,562.

In the preferred embodiment process in accordance with parameter settingA in Table I, backside chamber 114 is made to have a pressure of 0.5torr by injecting Ar gas into backside chamber 114 via an inlet port(not shown). A pressure transducer (not shown) located in backsidechamber 114 is used to measure the pressure in backside chamber 114. Theprecise value of the relatively high backside chamber pressure is notsignificant as long as the pressure is sufficient to prevent processgases in reaction chamber 104 from entering backside chamber 114 andnucleating with the back surface of silicon wafer 1. However, thebackside pressure should not exceed approximately 1.0 torr because lossof selectivity around the water edge may occur.

In accordance with parameter setting A in Table I, the reaction chamberpressure is maintained at 80 mtorr.

The gases in reaction chamber 104 are withdrawn via high conductancevacuum port 116 through openings in wafer clamp assembly 100 so as tokeep the residence time of any byproducts in chamber 104 below 10milliseconds. The rate of withdrawal of the gases in chamber 104 keepsthe process gases flowing at the desired rate and maintains the desiredreaction chamber pressure.

A(6). FORM OPTICALLY OPAQUE REFRACTORY METAL LAYER ON N AND P TYPEREGIONS AT LOW TEMPERATURE

In step 6, the temperature of the wafer is slowly increased above roomtemperature by a directed radiation source while injecting therefractory metal based gas (e.g., WF₆) into the reaction chamber so thatthe refractory metal deposition rate on the silicon is very low.

As the temperature of the water is slowly ramped up, but still heldbelow approximately 100° C., the refractory metal based gas is reducedby the exposed silicon on the surfaces of n type region 2 and P typeregion 3 in FIG. 1c and reduced by the silicon which diffused throughthe base layer of refractory metal deposited in step 5. The refractorymetal 120 is deposited over both N and P type silicon regions 2 and 3 ontungsten 90 at essentially equal rates, since the emissivities of N andP type silicon at temperatures below 100° C. are essentially equal.

Since the emissivities of N and P type silicon begin to diverge rapidlyat approximately 100° C. as shown graphically in FIG. 4, the temperatureramp must be slow enough to provide a resulting deposition of at leastan optically opaque layer (e.g., 100-500 Å) of refractory metal 120/90on both N and p type silicon regions 2 and 3 before the substratetemperature reaches approximately 100° C. The layer only need be opaqueto the frequencies outputted by the radiant heating means used in theCVD chamber. Once the opaque refractory metal layer has beenestablished, the emissivities of both N and P type silicon regions 2 and3 will approximate that of the refractory metal deposited, therebyestablishing an approximately equivalent deposition rate over both N andP type regions at the higher deposition temperatures.

FIG. 1c shows radiation 122 irradiating back substrate surface 124 ofwafer 1, while opaque refractory metal layer 120 forms over N typeregion 2 and P type region 3. By using WF₆ as the refractory metal basedgas, an opaque layer of tungsten is formed in this step in accordancewith the previously shown exothermic reduction reaction of eq. 1.

Without any reducing gas entering the chamber, the reduction reactionconsumes a few atomic thickness layers of the silicon substrate duringthe deposition of the opaque layer of tungsten over the exposed siliconregions. Since there is essentially no reduction of the refractory metalbased gas with the silicon dioxide insulating layer 4 at this lowtemperature, there is essentially no deposition of refractory metal onthe silicon dioxide layer 4.

In the preferred embodiment, this step 6 (parameter settings B and C inTable I) is carried out by providing ramped power to quartz halogen lamp126, shown in FIG. 3, while WF₆ is being injected into chamber 104 at arate of 4 sccm. As shown in parameter settings B and C in Table I, lamp126 remains off for five seconds, then is ramped up to 260° C. over aperiod of 45 seconds. The flow rates of H₂ and Ar, as well as thechamber pressure and backside chamber pressure, remain the same as instep 5.

Pyrometer 128, shown in FIG. 3, is used to measure the averagetemperature of the wafer and provides feedback for temperature control.

Also in this preferred embodiment process shown in Table I, even thoughthe opaque layer 120/90 can be formed without any reducing gas enteringthe reaction chamber 104, silicon tetrahydride (SiH₄) reducing gas, alsoknown as silane, is injected into chamber 104 at a flow rate of 2.6 sccmto help reduce the WF₆ so as to increase the deposition rate of therefractory metal and to ensure very little of the silicon surface isconsumed by the reduction process.

A(7). RAMP SUPPLY OF REDUCING GAS AT DEPOSITION TEMPERATURES

In step 7, the deposition temperature is held between 230° C. and 425°C. for a time to deposit a desired thickness of tungsten or otherrefractory metal on the selected areas of the silicon wafer. During thistime, the refractory metal based gas is injected into the chamber alongwith a reducing gas to reduce the refractory metal based gas, since thesilicon from the substrate is no longer able to diffuse through thedeposited metal layer to reduce the refractory metal based gas. In thepreferred embodiment, the refractory metal based gas WF₆ and thereducing gas is SiH₄, which causes the following exothermic reactions,depending on the relative amount of SiH₄ in the chamber:

    2WF.sub.6 +3SiH.sub.4 →2W+3SiF.sub.4 +6H.sub.2      (eq. 2)

    2WF.sub.6 +4.2SiH.sub.4 →0.4W.sub.5 Si.sub.3 +3SiF.sub.4 +8.4H.sub.2 (eq. 3)

The reduction reactions shown in equations 2 and 3 occur in thefollowing manner. The WF₆ fluorinates the surface of the opaque tungstenlayer deposited in step 6. SiH₄ reacts readily on this fluorinatedsurface to deposit silicon and form volatile silicon fluorides (SiF₄).The deposited layer of silicon then reacts with the WF₆ gas moleculesimpinging on the silicon layer to produce the reduction reaction ofequation 1. Thus, the reactions shown in equations 2 and 3 are actuallythe results of a series of sub-reactions, where in the WF₆ /SiH₄reduction reaction, tungsten film growth proceeds through cycles oftungsten/silicon deposition. Since neither the WF₆ or SiH₄ significantlystick to the insulating silicon dioxide layer 4 at these relatively lowdeposition temperatures, there is essentially no deposition of tungstenon the insulating silicon dioxide layer and, thus, selective depositionof tungsten is obtained.

As seen by the reduction reactions equations 2 and 3, as the quantity ofSiH₄ involved in the reduction reaction exceeds 1.5 the quantity of WF₆,silicon atoms are also deposited along with the tungsten. This isdesirable since, later, when the wafer is annealed to silicide therefractory metal/silicon substrate junction, there will be noconsumption of the silicon substrate as a result of using a siliconbased reducing gas. The anneal step also silicides and densifies theentire deposited layer, which lowers the resistivity of the barrierlayer. Thus, the amounts of WF₆ and SiH₄ injected into the CVD reactionchamber are preferably set to deposit a layer of WSi_(x), where xdepends on the process parameters. FIG. 5 is a graph showing theresulting Si/W ratio in a deposited layer at a deposition temperature of320+-380° C. in response to varying the SiH₄ /WF₆ ratio.

Inportantly, during the preferred embodiment of step 7, the amount ofSiH₄ reducing gas provided to the CVD chamber is ramped to follow theincreasing temperature of the contact area. Since the reduction reactionof the WF₆ (or other refractory metal based gas) when combined with SiH₄is an exothermic reaction, as more tungsten is being deposited, thetemperature of the deposited tungsten increases. As the temperature ofthe contact area increases, the ramped up supply of SiH₄ increases thedeposition rate of the refractory metal while the desirable columnargrain structure of the barrier layer is maintained due to the increasedtemperature at which the reaction occurs. Care must be taken to notsupply too much SiH₄ to the reaction prior to the temperature of thecontact area rising to a certain level to maintain the columnar grainstructure or else the grain structure of the resulting barrier layerwill grow rapidly in an undesirable isotropic fashion.

Thus, by ramping up the supply of SiH₄ to the reaction chamber, thedeposition rate of refractory metal is increased without incurring anyadverse effects. In the prior art, it was not appreciated that thedesired columnar grain structure could be maintained with an increasingsupply of SiH₄ ramped up as the temperature of the contact areasincrease.

The resulting structure after step 7 is shown in FIG. 1d. In thepreferred embodiment, the deposited barrier layer 132 is formed tocomprise between 5 and 20 atomic % Si (or between 1 and 4 weight % Si).Using the above-described process, the layer 132 comprises approximately12 atomic % Si, although all that is needed is for the composition toexceed 5 atomic % Si to avoid reduction of the Si substrate.

Referring to the CVD chamber of FIG. 3, the gas routing network, of FIG.2, and parameter settings C--H in Table I, step 7 is carried out byramping up quartz halogen lamp 126 over a 45 second period to achieve ameasured wafer temperature of 260° C. During the ramping up of lamp 126,SiH₄ is injected into chamber 104 at a rate of 2.6 sccm by controllingvalve 24. The remaining gas flows and pressures are identical to shoeused in process parameter setting B of Table I.

After the measured temperature of 260° C. is reached, the temperature ismaintained for 10 seconds (process parameter D in Table I) with gas flowrates remaining unchanged. After this time (process parameter setting Ein Table I), the flow rate of SiH₄ is increased from 2.6 sccm to 2.8sccm to increase the deposition rate of refractory metal as thetemperature of the deposited barrier layer increases to above 260° C.due to the reducing reaction being exothermic.

In practice, the ramping of SiH₄ depends on the extent of exposedsilicon area of the wafer. In the above-described process, it is assumedless than 3% of the wafer surface comprises exposed Si. If more of thesilicon is exposed, the SiH₄ may be ramped up faster.

During each of sequential process parameter settings F, G, and H, eachlasting for ten seconds, the supply of SiH₄ is increased in incrementsof 0.2 sccm, until a final flow rate of 3.4 sccm is achieved for theSiH₄.

A(8). REMOVAL OF PROCESS GASES FROM CHAMBER AND ANNEAL

In step 8, the wafer is allowed to cool, the process gases are removedfrom the chamber, and a rapid thermal anneal step is used to silicidethe refractory metal/silicon substrate interface and thereby lower thecontact resistivity. Also, during this step, the silicon atoms withinthe barrier layer react with the deposited refractory metal to form asilicide. Since the reducing gas is silicon based, the depositedrefractory metal already contains silicon, and the silicon substrate isnot significantly consumed during this step. In the preferredembodiment, this anneal is accomplished at between approximately 650° C.to 900° C. for approximately 10-30 seconds.

Table I, in parameter settings I-K, shows the preferred cool-down andpurging step conducted prior to annealing, where, in setting I, lamp 126is turned off, the injection of process gases SiH₄, H₂, Ar, and WF₆ intothe chamber is ceased by closing the appropriate valves in FIG. 2, andthe pressures in reaction camber 104 and backside chamber 114 arereduced to less than 18 mtorr.

In parameter setting J, H₂ is allowed to enter reaction chamber 104 at aflow rate of 300 sccm, and Ar is allowed to enter reaction chamber 104at a flow rate of 50 sccm, in order to promote cooling of the wafer andto purge gas lines 52 and 54 and reaction chamber 104 of any remainingSiH₄ and WF₆. The pressure in reaction chamber 104 is kept at 800 mtorr,while the backside chamber pressure is held at 1.0 torr. Setting J isheld for approximately 45 seconds so that the wafer is sufficientlycooled and the lines and reaction chamber are sufficiently purged.

In parameter setting K, the gases are removed from reaction chamber 104,and the pressures in reaction chamber 104 and backside chamber 114 arelowered to below 18 mtorr for five seconds.

The anneal step is conducted during process parameter setting L, wherelamp 126 is supplied ramped power to heat the wafer to approximately700° C. over a 20 second period. During this time, H₂ is supplied toreaction chamber 104 at a rate of 150 sccm, and Ar is supplied toreaction chamber 104 at a rate of 5 sccm. The pressure in reactionchamber 104 is maintained at 80 mtorr, while the backside chamber 114pressure is maintained at 0.5 mtorr. During this anneal step, thedeposited barrier layer densifies and shrinks approximately 10%. thisshrinkage is primarily due to the tungsten bonding with the siliconwithin barrier layer 132. The amount of shrinkage depends on the annealtemperature and the Si content in barrier layer 132.

The resulting barrier layer 132 formed during the preferred processsteps 5-8 (parameter settings A-L of Table I) is approximately 6500 Åthick.

A(9). COOL DOWN WAFER AD REMOVE FROM CVD CHAMBER

In step 9, the wafer is cooled down after annealing to bring thesubstrate to a temperature below 100° C., before removal from the CVDchamber. This cooling step is accomplished by turning off power to lamp126 and allowing the wafer to cool for at least 45 second stop approachambient temperature. To promote further cooling, gases H₂ and Ar may beinjected into reaction chamber 104 at flow rates of 300 sccm and 50sccm, respectively, for approximately 45 seconds while providing areaction chamber pressure of 800 mtorr and a backside chamber pressureof 1.0 torr. The H₂ and Ar gases are then shut off, and the wafer isremoved from the reaction chamber.

A(10). CONDUCT METALLIZATION

After the barrier layer is formed, an aluminum deposition process, orother applicable metal or polysilicon deposition process, is conducted,using conventional techniques, to form a conductive interconnect layerover the deposited barrier layer, In the preferred embodiment, aluminumis deposited for he interconnect layer using a sputter depositionprocess. The resulting structure is shown in FIG. 1e, where conductivelayer (Al) 136 is shown overlying barrier layer 132.

A(11). ADDITIONAL FEATURES

To achieve best results during refractory metal deposition steps 4-7,the residue time of reaction by-products (e.g., silicon fluorides)should be kept to below 10 milliseconds. Residence time is calculated asfollows: ##EQU1## τ=residence time (seconds) V=volume of CVD chamber(liters)

S=rate of gas being pumped away (liters/second)

P=pressure of chamber (torr)

Q=flow rate of gas into chamber (torr.liters/second)

In the preferred embodiment structure, the pumping manifold to the CVDprocess chamber has a conductance of≧50 torr liters per second. Using achamber pressure of 120 mtorr and a chamber volume of 49 liters, theresidence time of the gas within the process chamber will beapproximately 9.8×10⁻³ seconds.

Further, the process gases entering the CVD chamber should be kept to atleast 99.999 designated purity, and critical gas flows should becontrolled to within±0.2 sccm of flow setpoint from wafer to wafer toachieve sufficient repeatability. Additionally, the liquid gas containercontaining the WF₆ (or other refractory metal based gas) is cooled topreferably 5° C. below room temperature to prevent condensation of thegas in the gas lines.

The above-described process for forming a barrier layer over regions ofsilicon may be used with other than the process gases specificallydescribed with respect to the preferred embodiment. For example,refractory metal based gases comprising refractory metals molybdenum,palladium, platinum, or tantalum may be used. A reducing gas other thanthat described in the preferred embodiment may also be used whereappropriate. Of course, the gas flow rates, temperatures, process times,pressures, and apparatus limitations described with respect to thepreferred embodiment process may be modified as necessary to form abarrier layer having the desired characteristics.

Further information regarding the characteristics of tungsten silicideand regarding various other processes for forming a silicide layer arefound in the following publications, incorporated herein byreference: 1) VSLI Process Technologies, ICVC '89, published Oct. 17,1989; 2) presentation materials entitled "Chemical Vapor Deposition ofInterconnect Metals (emphasizing Tungsten)" by Robert S. Blewer, Jan.25, 1988.

B. BLANKET DEPOSITION PROCESS

In blanket deposition, a refractory metal is deposited on the exposedsilicon regions as well as on the surface of the insulating silicondioxide layer. Typically, after blanket deposition, the refractory metallayer deposited over the oxide layer is then completely etched awayusing a blanket etch so that the refractory metal remains only over thesilicon regions to be electrically contacted by the refractory metal. Ametallization layer is then typically formed over the surface of thewafer to contact the deposited refractory metal in order to electricallycontact the underlying silicon regions.

Other uses of blanket depositions include depositing the refractorymetal over a gate oxide layer and selectively etching the refractorymetal layer to form gates for MOS devices.

In the preferred process to blanket deposit a refractory metal over thesurface of a patterned wafer, the preliminary steps 1-4 of cleaning thesurface of the silicon wafer, removing any damage to the silicon crystallattice, and purging the various gas lines are conducted as describedabove with respect to steps 1-4.

In step 5 of the preferred embodiment blanket deposition process, aftersteps 1-4 are carried out and the wafer is placed in a CVD chamber suchas that shown in FIG. 3, the wafer is then heated to a depositiontemperature of approximately 500° C., and SiH₄ is allowed to enter thechamber to nucleate with the exposed silicon and SiO₂ for a period ofapproximately two seconds. This forms a few monolayers of SiH₄ over theSiO₂ to enable the subsequent reduction of WF₆ when WF₆ is later allowedto enter the chamber. FIG. 7a shows this step where radiant heat 150supplied by lamp 126 in FIG. 3 heats wafer 1 during eh injection of SiH₄into CVD chamber 104, causing a deposition of thin SiH₄ layer 152 overthe surface of wafer 1.

The various pressures and flow rates of process gases SiH₄ and H₂ aresimilar to that shown in parameter setting C in Table I. No WF₆ or Ar isinjected at this time.

In step 6, a depositioning process similar to that described withrespect to step 7 of the selective deposition process, previouslydescribed, is conducted, where WF₆ is injected into the CVD chamberalong with SiH₄. This step is conducted until a barrier layer composedof WSi_(x), where x depends on the ratio of SiH₄ to WF₆ used during thedeposition process, having a desired thickness is formed over both thesilicon and the oxide. The ratio of SiH₄ to WF₆ is reduced to belowunity in order to achieve a columnar grain structure. This step is shownin FIG. 7b where deposited layer 158 is formed over the surface of thewafer 1.

In the preferred embodiment process, this deposition step is conductedgenerally using parameter settings D-H of Table I, where the quantity ofreducing gas SiH₄ is ramped up with time as the exothermic reduction gasSiH₄ is ramped up with time as the exothermic reduction reactionscontinually raise the temperature at the surface of the depositedbarrier layer 158. In this step, however, the deposition temperature ismaintained at approximately 500° C.

Ramping should be ceased at the time when there is no further increasein barrier layer temperature due to the heat produced by the exothermicreduction reactions being more quickly removed as the barrier layerfills the contact regions.

In step 7, after the barrier layer 158 is deposited, the gas lines andthe CVD process chamber are purged and the wafer is cooled similar tothe described with respect to step 7 of the above-described process andparameter settings I-K in Table I.

An anneal step is conducted at temperature of between 650° C. to 900° C.for approximately 10-30 seconds with process parameter settings similarto that in parameter setting L of Table I.

The resulting barrier layer 158 is then etched using one of any numberof well known blanket plasma etching techniques, or other acceptableetching technique, so as to leave the deposited barrier layer 158 onlywithin the contact areas, such as shown in FIG. 7c. In certainapplications, this barrier layer 158 may be used as an interconnectlayer and, thus, no blanket etch would be conducted.

A metallization layer or other conductive layer 160 is then depositedand etched, as shown in FIG. 7d. Conductive layer 160 forms an ohmiccontact with the deposited barrier layer 158 and with regions 2 and 3.

Additional features to improve the quality of the deposited barrierlayer are identical to those described with respect to the processdescribed above, for selectively forming a refractory metal silicidelayer.

C. DEPOSITION PROCESS FOR FORMING A VIA ON A POLYSILICON LAYER

The process described in steps 1-9 of the selective deposition processor steps 1-7 of the blanket deposition process may generally be used tofrom vias between a polysilicon layer and a metal layer or between twometal layers.

A representative wafer having a via formed in accordance with thepreferred method is shown in FIG. 8. In FIG. 8, wafer 1 includes N typeregion 2 and P type region 3. Polysilicon layer 170 is formed usingconventional methods to contact regions 2 and 3. Oxide layer 4 insulatespolysilicon layer 170 for the silicon wafer 1. Insulating layer 172 isformed over polysilicon layer 170 to expose a contact portion ofpolysilicon layer 170, over which is deposited refractory metal via 174.In FIG. 8, refractory metal via 174 comprises WSi_(x), where x dependson the ratio of reducing gas SiH₄ to WF₆ used in the deposition process.A metal layer 178, such as comprising AlSi, is then formed overinsulating layer 172 to contact via 174 and to provide an electricalconnection between metal layer 178 and polysilicon layer 170.

When depositing a refractory metal on a polysilicon layer to form a via,the wafer is cleaned in accordance with previously described steps 1 and2, and the gas lines and CVD chamber are purged in accordance withpreviously described step 4. Step 3 of the previously described processfor removing any damage to the crystal lattice structure of thesubstrate is, of course, deleted.

In a selective deposition process to form a via, although there are notproblems with different emissivities of N and P regions in thepolysilicon layer, it is still desirable to conduct step 6 to deposit athin layer of refractory metal on the polysilicon prior to injectingSiH₄ into the CVD chamber to achieve a stronger bond between the via andthe polysilicon and to ensure selectivity. A thin layer of thepolysilicon will be consumed.

The remaining deposition and anneal steps for the selective depositionprocess are basically identical to those previously described forforming a conductive barrier layer between regions in a substrate and ametal layer. Of course, process times, gas flow rates, and temperaturesmay be changed to achieve the desired characteristics of the depositedrefractory metal via.

For blanket deposition, SiH₄ is first injected into the chamber at adeposition temperature of approximately 500° C. for approximately 2seconds to form a thin SiH₄ layer over the surface of the wafer. Thismethod is similar to that discussed with respect to FIG. 7a. WF₆, alongwith SiH₄, is then introduced to form a barrier layer similar to thatdescribed with respect to FIG. 7b. The deposited layer is etched, and ametallization process is conducted similar to the method discussed withrespect to FIGS. 7c and 7d.

DEPOSITION PROCESS FOR FORMING A VIA ON A METAL LAYER

To form a via between two aluminum layers, or between any two metallayers, it is desirable to form the aluminum layers to contain siliconatoms to prevent the Al atoms from reacting with the oxide surface ofthe wafer.

To selectively deposit a refractory metal layer over an aluminum layerto create a via, a patterned layer of oxide 201 or other insulatingmaterial is formed over the aluminum layer, using conventionaltechniques, to expose contact regions. This starting structure is shownin FIG. 9a. FIG. 9a shows wafer 1 having P or N type region 2' formedtherein and contacted by refractory metal barrier layer 200, formed bymethods previously described herein. Over barrier layer 200 is formedaluminum layer 202, over which is formed patterned oxide layer 204. Thefollowing preferred process is then implemented.

D(1). CLEAN WAFER SURFACE

In step 1, to selectively deposit a barrier layer over aluminum layer202, the exposed aluminum is cleaned by, preferably, using aconventional RF sputter etch process. In a preferred embodiment, Ar ionsare used in the sputter etch using a bias voltage of -600 volts or less.In a preferred embodiment structure for carrying out this etch step, aVarian Model 5101 CVD system is modified to have a sputter etch stationconnected thereto, as shown in FIG. 10. The Varian 5101 CVD chamber hasbeen previously described with respect to FIG. 3 and is described inU.S. Pat. No. 4,796,562.

In FIG. 10, CVD chamber 210 is connected to sputter etch chamber 212 viaa wafer transport system 214. Load locks (not shown) between wafertransport system 214 and chambers 210 and 212 are used so that thepressure in chamber 210 is not affected by the pressure in chamber 212while wafer transport system 214 is not being used. Connected to CVDchamber 210 and sputter etch chamber 212 are gas lines 216 and 218 fromgas box 219, which is described with respect to FIG. 2.

The Ar gas supplied to sputter etch chamber 212 via gas line 218 iscontrolled by the valve arrangement shown in FIG. 11, which is locatedwithin gas box 219 and adjacent network 5 shown in FIG. 2a. in FIG. 11,the various filters, MFC, and valves associated with Ar gas line 250 aresimilar to those corresponding components connected to Ar gas line 46 inFIG. 2a. In FIG. 11, a krypton gas source is shown connected to Kr gasline 252. This Kr source and associated valves are not used in thepreferred sputter etch process.

Automated control system 221 controls the various functions of CVDchamber 210, sputter etch chamber 212, wafer transport system 214 andgas box 219 by sending the appropriate signals on wires 260, 262, and264, respectively.

in the preferred embodiment process, the wafer of FIG. 9a is placed in acassette tray and the cassette tray is placed into a cassette chamberwithin wafer transport system 214. Wafer transport system 214 is similarto that described in U.S. Pat. No. 4,796,562. The wafer transport system214 uses manipulator arms to place a wafer from the cassette tray intosputter etch chamber 212, which at a very low pressure (e.g., 1×10⁻⁴torr). Sputter etch chamber 212 containing Ar gas is then operated forcleaning the surface of the wafer to remove any oxide for the surface ofaluminum layer 202 and to remove any contaminants from the surface ofthe wafer which may adversely affect the selective deposition of therefractory metal on aluminum layer 202. This step also cleans the SiO₂surface to prevent any subsequent nucleation of WF₆ or SiH₄ processgases with the SiO₂ surface.

In the preferred embodiment a sputter etch using a bias voltage ofpreferably -580 volts and 400 watts of RF power is conducted at roomtemperature for approximately 60 seconds at a pressure of 14 mtorr andan Ar gas flow rate of 48.5 sccm.

After this etching step is conducted, wafer transport system 214 andsputter etch chamber 212 are pulled down to a pressure of approximately1×10⁻⁴ torr. The load lock between sputter etch chamber 212 and wafertransport system 214 is then opened so that the wafer may be transportedvia a manipulator arm out of sputter etch chamber 212.

The load locked between wafer transport system 214 and sputter etchchamber 212 is closed and the load lock between wafer transport system214 and CVD chamber 210 is opened so that the manipulator arm can placethe etched wafer into position within CVD chamber 210 without he waferbecoming contaminated. Once the wafer has been transported to CVDchamber 210 and clamped by wafer clamp assembly 100 onto quartz chuck102, as shown in FIG. 3 and described in U.S. Pat. No. 4,796,562, wafertransport system 214 is sealed off from CVD chamber 210 and thefollowing deposition process is conducted.

The preferred process for forming a via contacting two aluminum layersafter the wafer is cleaned in step 1 is shown below in Table II.

                                      TABLE II                                    __________________________________________________________________________    Parameter                                                                           Dur.                                                                             Temp.  Pressure                                                                             BSGAS                                                                              SiH.sub.4                                                                         WF.sub.6                                                                          H.sub.2                                                                           Ar                                    Setting                                                                             (sec)                                                                            (°C.)                                                                         (mtorr)                                                                              (torr)                                                                             (sccm)                                                                            (sccm)                                                                            (sccm)                                                                            (sccm)                                __________________________________________________________________________    A      7 A (≦30° C.)                                                            50     0.5  0   4.0 150 5                                     B     120                                                                              450    50     0.5  0   4.0 150 5                                     C     45 A      800    1.0  0   4.0 300 50                                             (450→A)                                                       D      5 A      BASE   0    0   0    0  0                                                     (≦18 mtorr)                                            E      7 A      70     0.5  0   4.0 150 5                                     F      5 A      70     0.5  2.6 4.0 150 5                                     G     45 500    70     0.5  2.6 4.0 150 5                                              (A→500)                                                       H     10 500    70     0.5  2.6 4.0 150 5                                     I     10 500    70     0.5  2.8 4.0 150 5                                     J     10 500    70     0.5  3.0 4.0 150 5                                     K     10 500    70     0.5  3.2 4.0 150 5                                     L     10 500    70     0.5  3.4 4.0 150 5                                     M      5 A      BASE   0    0   0    0  0                                              (500→A)                                                       N     45 A      800    1.0  0   0   300 50                                             (500→A)                                                       O      5 A      BASE   0    0   0    0  0                                     __________________________________________________________________________

After the wafer is sputter etched, the wafer undergoes a saturation stepin step 2 wherein a refractory metal based gas is injected into the CVDchamber at room temperature (e.g., less than 30° C.) for a short period.In a preferred embodiment, step 2, shown as parameter setting A in TableII, is conducted for seven seconds with a WF₆ flow rate of 4.0 sccm, aH₂ flow rate of 150 sccm, and an Ar flow rate of 5 sccm. Referring tothe CVD chamber shown in FIG. 3, during this step, reaction chamber 104is made to have a pressure of 50 mtorr and backside chamber 114 is madeto have a pressure of 0.5 torr. This step is used to improve bondingbetween the subsequently formed via and the metal layer.

D(3). FORM INITIAL LAYER OF REFRACTORY METAL ON EXPOSED ALUMINUM SURFACE

In step 3, shown in Table II as parameter settings B-D, the temperatureof the wafer is raised to approximately 450° C. for 120 seconds, and therefractory metal gased gas is injected into the chamber along with H₂and Ar, at the same flow rates as in parameter setting A.

Selective deposition of the refractory metal on only the aluminum metallayer occurs since, initially, the WF₆ reacts with the aluminum layer todeposit a few monolayers of refractory metal in accordance with thefollowing equation:

    WF.sub.6 +2Al→2AlF.sub.3 +W                         (eq. 5)

At the 450° C. deposition temperature, the patterned oxide layeroverlying the aluminum layer does not cause a reduction reaction tooccur when contacted by WF₆. Once the initial layer of the refractorymetal is formed on the aluminum, the H₂ is able to reduce the refractorymetal based gas at the surface of the aluminum layer in accordance withthe following equation:

    WF.sub.6 +3H.sub.2 →W+6HF                           (eq. 6)

As shown in parameter setting C of Table II, the temperature of thewafer is ramped down to ambient temperature and the pressure inside theCVD chamber is increased.

As shown in parameter setting D, the gases in the chamber are purged. Asdiscussed previously, the appropriate valves, shown in FIG. 2, areoperated to inject the desired flow rate of process gases into the CVDchamber.

The resulting wafer after completion of step 3 is shown in FIG. 9b,where refractory layer 220 is deposited on aluminum layer 202.

D(4). DEPOSITION USING REDUCING GAS SiH₄

In parameter setting E, at room temperature, WF₆, H₂, and Ar gases areagain injected into the CVD chamber for approximately seven secondsprior to SiH₄ being injected into the chamber to ensure an overabundanceof WF₆ in the CVD chamber when SiH₄ is subsequently injected into theCVD chamber.

In step 4, shown as parameter setting F, SiH₄ is injected into the CVDchamber for about five seconds prior to the wafer being ramped up intemperature. SiH₄ is used to obtain a high deposition rate of therefractory metal over the exposed aluminum layer.

Also in step 4, as shown in parameter settings G-L, the temperature ofthe wafer is ramped up to approximately 500° C. over a period of 45seconds and maintained at this temperature for 50 seconds. During thistime, the supply of SiH₄ is ramped up from 2.6 sccm to 3.4 sccm so as toincrease the deposition rate of the refractory metal as the temperatureof the deposited refractory metal layer increases due to the exothermicreduction reactions. As previously described, although an increasedamount of SiH₄ is supplied to the reaction, the columnar grain structureof the deposited refractory metal is preserved due to the increasedtemperature of the deposited refractory metal from the exothermicreduction reactions.

The resulting wafer after completion of step 4 is shown in FIG. 9c,where deposited refractory metal (WSi_(x)) layer 222 is deposited overrefractory metal (W) layer 220.

D(5). COOL DOWN WAFER

In step 5, corresponding to parameter settings M-O, the wafer is cooledby ramping down power to lamp 126 in FIG. 3 as the gases in the CVDchamber are evacuated. In parameter setting N, the temperature of thewafer is further ramped down to ambient temperature over a period of 45seconds by lowering the power applied to lamp 126 in FIG. 3. H₂ and Arare injected into the CVD chamber to achieve a pressure in CVD chamber104 of 800 mtorr and a pressure in backside chamber 114 of 1.0 torr. Theprocess gases are again removed as shown in parameter setting O.

The CVD chamber is pumped out, and the load lock between wafer transportsystem 214 and CVD chamber 210 is opened The manipulator arm removes thewafer from CVD chamber 210 and places it into a cassette within wafertransport system 214 in a manner similar to that described in U.S. Pat.No. 4,796,562. To remove the wafer from wafer transport system 214, N₂is injected into wafer transport system 214 to pressurize system 214 toslightly higher than atmospheric pressure. The cassette containing thewafer (and containing other wafers in the lot) is then removed.

There is no anneal step necessary to form a silicide of the depositedlayer at this stage, since an anneal step will be performed anyway afterthe wafer has undergone all processing steps.

The above-described process forms a via of approximately one micron inthickness.

An aluminum layer 224 is then formed over the surface of the wafer, asshown in FIG. 9d, using conventional techniques. Deposited refractorymetal 222 now forms a via between aluminum layers 202 and 224.

E. BLANKET DEPOSITION PROCESS FOR FORMING A VIA BETWEEN TWO METAL LAYERS

To form a refractory metal via between two metal layers using blanketdeposition, no sputter etching of the wafer surface is required. Thus,the wafer is initially placed in CVD chamber 210 in FIG. 10 via wafertransport system 214.

SiH₄ is injected into CVD chamber 210 at a deposition temperature ofbetween 265° C. and 500° C. for two seconds to promote blanketdeposition on the aluminum as well as the oxide surface.

WF₆ is then injected, along with the SiH₄, until a barrier layer of adesired thickness is formed. This blanket deposition process describedthus far is identical to that described with respect to FIGS. 7a and 7b,except the deposition temperature must not exceed 500° C. due to therelatively low melting point of aluminum.

After the refractory metal barrier layer is deposited to the desiredthickness, the refractory metal is etched so as to leave only a viahaving a desired thickness.

An upper metal layer is then formed, using conventional techniques, overthe wafer surface.

The resulting structure is similar to that shown in FIG. 9d, except purerefractory metal layer 220 is not formed during this blanket depositionprocess.

As in the previously described processes, to ensure repeatability andgood results, the residence time of reaction by-products should be keptbelow 10 milliseconds, the reactive gases should be kept to at least99.999 designated purity, and critical gas flows should be controlled towithin ±0.2 sccm.

F. ADDITIONAL PROCESS AND APPARATUS FEATURES

After a number of wafers are processed using any of the above-describedmethods, portions of the CVD chamber, such as quartz chuck 102 in FIG.3, will become coated with a layer of refractory metal and undesirablyabsorb radiation and react with the gases in the process chamber. Whenit is desired to clean the chamber, an etch gas of NF₃ is injected intothe chamber by, for example, opening valves 17, 37, and 38 in FIG. 2. Inthe prior art, this etch step is conducted while the CVD chamber is atroom temperature. A drawback of this prior art method is that the NF₃reacts with the quartz (SiO₂) in the chamber, and with any reactionby-products remaining in the chamber, and forms a condensation of SiF₄or other fluorides.

To avoid this condensation problem, the reaction chamber walls areheated to above 65° C. by, for example, a closed loop heating unit suchas that manufactured by Mydax, while maintaining a chamber pressure ofless than approximately 80 mtorr during etching the chamber with NF₃.Any condensation is avoided in this novel process, since at thistemperature, the SiF₄ or other formed fluoride is volatile and is purgedaway with the N₃.

Table II below shows a preferred process for conducting this NF₃ etch ofthe CVD chamber, such as CVD chamber 104 in FIG. 3.

                  TABLE III                                                       ______________________________________                                                                            RF    Wall                                Step NF.sub.3 H.sub.2  Time Press   Power Temp.                               ______________________________________                                        A    50 sccm   0       5'    80 mtorr                                                                             200 W 90° C.                       B     0        0       5'    80      0    90° C.                       C     0       175 sccm 5'    80     200 W 90° C.                       D     0        0       5'    80      0    90° C.                       E     0       350 sccm 5'   800      0    90° C.                       F     0        0       5'    80      0    90° C.                       ______________________________________                                    

In step A of Table II, 50 sccm of NF₃ is injected into CVD chamber 104of FIG. 3 at a low pressure (at or below 80 mtorr). Two hundred watts ofRF power is then applied for a period of approximately five minutes,while the quartize walls of the CVD chamber are kept at approximately90° C. No backside gas is used to pressurize backside chamber 114 inFIG. 3.

In step B, the RF power is turned off and the NF₃ gas is withdrawn forthe chamber.

In step C, 175 sccm of H₂ is injected into the CVD chamber, and RF powerof 200 watts is again applied for five minutes to clean up residue inthe chamber.

In step D, the chamber is again evacuated.

In step E, 350 sccm of H₂ is injected into the CVD chamber at a chamberpressure of 800 mtorr for five minutes to flush out impurities from theetching process.

In step F, the chamber is again evacuated.

The CVD chamber has now been cleaned and is ready for further depositionprocesses.

Due to the corrosive nature of NF₃, it is preferable to replace allcopper gaskets, which are relatively reactive, in the CVD chamber withaluminum gaskets.

Further novel features used in the preferred process to deposit a layerof refractory metal include the use of gas ejector rings in the CVDchamber, such as rings 108 and 110 in FIG. 3, having an improved gasdiffusing means so as to evenly diffuse the gas exiting the rings intothe CVD chamber. In the preferred embodiment, shown in FIGS. 12 and 13,gas ejector ring 260 has fitted on its upper portion a diffusing means262 composed of grains of stainless steel, or grains of an equivalentinert material, sintered together to randomly direct the gas escapingthrough spaces between the sintered grains. Preferably, the average sizeof the powder grains is in the range of 0.5 to 2.0 microns. In thepreferred embodiment, the thickness of diffusing means 262 is 0.062 in.while the diameter of diffusing means 262 is approximately 7 in.However, diffusing means 262 and ring 264 may be any size as appropriatefor the specific application.

Non-porous support ring 264 is preferably composed of stainless steel.

As a practical embodiment, the diffusing means may be formed by cuttingto a desired shape a prefabricated sheet of sintered stainless steelpowder, available from Mott Metallurgical Corporation, Farmington, Conn.The ring-shaped diffusing means 262 is then welded to non-porous supportring 264. An inlet port 266 allows gas to enter gas ejector ring 262.

In the preferred apparatus for conducting the various processesdescribed herein, the various gas flows and other process parameters areperformed automatically under control of a computer, shown as automatedcontrol system 221 in FIG. 10. Thus, human error is avoided by theautomation of the various processes described above. One of ordinaryskill in the art may easily develop a software program and controlsystem to automate a process which will result in the desiredcharacteristics of the deposited refractory metal layer. The softwareused in the preferred embodiment further controls the gas line purgefunction, described with respect to step 4 in the selective depositionprocess, previously described.

The preferred embodiments described above are intended to merelyillustrate only exemplary embodiments of the processes and structuresused to deposit a refractory metal and are not intended to limitinvention. As should be understood, any appropriate refractory metalbased gas or reducing gas may be used in the above-described processes.Various other embodiments will become obvious to those skilled in theart while keeping with the intended scope of the invention.

What is claimed is:
 1. A structure for filtering process gases prior tosaid process gases being allowed to enter a CVD chamber, said structurecomprising:input ports connected to sources of said process gases; firstvalve means connected immediately downstream from each of said inputports for coupling said input ports to first sections of a gas line;first filter means located immediately downstream from said first valvemeans; second valve means located downstream from said first filtermeans for coupling said first sections of said gas line to secondsections of said gas line; and second filter means connected betweensaid second gas valve means and said CVD chamber.
 2. The structure ofclaim 1 further comprising an enclosure enclosing said input ports,first valve means, first filter means, second valve means, and saidsecond filter means, and further comprising an internal heating elementlocated within said enclosure for baking said structure to vaporizecontaminants within said structure.
 3. The structure of claim 1 whereinsaid sources of said process gases supply tungsten hexafluoride andsilane.
 4. The structure of claim 1 wherein said first filter meanscontains an organometallic compound and said second filter means is aporous gas filter.